Bumili 0831 000 X5F0 470 J sa BYCHPS
Bumili na may garantiya
0831 000 X5F0 470 J
- Numero ng Bahagi:
- 0831 000 X5F0 470 J
- Manufacturer:
- CTS Electronic Components
- Paglalarawan:
- CAP CER 47PF X5F RADIAL
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 13992 Pieces
- Data sheet:
- 0831 000 X5F0 470 J.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 0831 000 X5F0 470 J, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 0831 000 X5F0 470 J sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | - |
|---|---|
| pagpapaubaya: | ±5% |
| Kapal (Max): | - |
| temperatura koepisyent: | X5F |
| Sukat / Dimension: | 0.290" Dia (7.37mm) |
| serye: | - |
| Ratings: | - |
| packaging: | Bulk |
| Package / Kaso: | Radial, Disc |
| Ibang pangalan: | 0831000X5F0470J 831000A470J |
| operating Temperature: | - |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | 0831 000 X5F0 470 J |
| Lead Style: | Straight |
| Lead Spacing: | 0.250" (6.35mm) |
| Taas - Makaupo (Max): | - |
| Mga tampok: | - |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 47pF ±5% Ceramic Capacitor X5F Radial, Disc |
| paglalarawan: | CAP CER 47PF X5F RADIAL |
| kapasidad: | 47pF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 0831 000 X5F0 470 J
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers