Bumili 0LCC7 sa BYCHPS
Bumili na may garantiya
0LCC7
- Numero ng Bahagi:
- 0LCC7
- Manufacturer:
- Littelfuse
- Paglalarawan:
- FUSE ACS CLIP CLMP 400A 250/600V
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 19212 Pieces
- Data sheet:
- 0LCC7.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 0LCC7, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 0LCC7 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | - |
|---|---|
| Ibang pangalan: | LCC7 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | 0LCC7 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | Fuse and Clip |
| paglalarawan: | FUSE ACS CLIP CLMP 400A 250/600V |
| accessory Type: | Clamp |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 0LCC7
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
LJ60060PC | Littelfuse Inc. | FUSE BLOCK ACS COVER 60A 600V | Pagtatanong |
 |
OPMNGSA354 | Eaton | COMB BAR 3POS 54MM OPM FUSE HLDR | Pagtatanong |
|
0LCC1 | Littelfuse Inc. | FUSE ACS CLIP CLAMP 30A 250V | Pagtatanong |
|
0LCC6 | Littelfuse Inc. | FUSE ACS CLIP CLMP 200A 250/600V | Pagtatanong |
|
0LCC5 | Littelfuse Inc. | FUSE ACS CLIP CLMP 100A 250/600V | Pagtatanong |
|
0LCC2 | Littelfuse Inc. | FUSE ACS CLIP CLAMP 60A 250/600V | Pagtatanong |
|
0LCC8 | Littelfuse Inc. | FUSE ACS CLIP CLMP 600A 250/600V | Pagtatanong |
 |
4420.0189 | Schurter Inc. | ACCY MOD RELAY TRIP 20-48VAC/DC | Pagtatanong |
|
0LCC4 | Littelfuse Inc. | FUSE ACS CLIP CLAMP 60A 600V | Pagtatanong |
|
3PH6P25MM | Littelfuse Inc. | BUSBAR 3 PHASE 6 POLE 25X104MM | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers