Bumili 107DCN2R7SLB sa BYCHPS
Bumili na may garantiya
107DCN2R7SLB
- Numero ng Bahagi:
- 107DCN2R7SLB
- Manufacturer:
- Illinois Capacitor
- Paglalarawan:
- CAP 100F -20%, +50% 2.7V T/H
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15424 Pieces
- Data sheet:
- 107DCN2R7SLB.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 107DCN2R7SLB, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 107DCN2R7SLB sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 2.7V |
|---|---|
| pagpapaubaya: | -20%, +50% |
| pagwawakas: | PC Pins |
| Sukat / Dimension: | 0.709" Dia (18.00mm) |
| serye: | DCN |
| packaging: | Bulk |
| Package / Kaso: | Radial, Can |
| Ibang pangalan: | 107DCN2R7SLB-ND 1572-1300 |
| operating Temperature: | -40°C ~ 60°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Bilang Bahagi: | 107DCN2R7SLB |
| Lifetime @ Temp.: | 1000 Hrs @ 60°C |
| Lead Spacing: | 0.295" (7.50mm) |
| Taas - Makaupo (Max): | 2.421" (61.50mm) |
| Ang pinalawak Paglalarawan: | 100F -20%, +50%(EDLC) Supercapacitor 2.7V Radial, Can 20 mOhm 1000 Hrs @ 60°C |
| ESR (Katumbas Series pagtutol): | 20 mOhm |
| paglalarawan: | CAP 100F -20%, +50% 2.7V T/H |
| kapasidad: | 100F |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 107DCN2R7SLB
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
226DCR2R3STU | Illinois Capacitor | CAP 22F -20%, +50% 2.3V T/H | Pagtatanong |
 |
107DCN2R7Q | Illinois Capacitor | CAP 100F -10%, +30% 2.7V T/H | Pagtatanong |
 |
EDLHW335D2R3R | Cornell Dubilier Electronics (CDE) | CAP 3.3F 2.3V THROUGH HOLE | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers