Bumili 1517-110M sa BYCHPS
Bumili na may garantiya
1517-110M
- Numero ng Bahagi:
- 1517-110M
- Manufacturer:
- Microsemi
- Paglalarawan:
- TRANS RF BIPO 350W 9A 55AW1
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18313 Pieces
- Data sheet:
- 1517-110M.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 1517-110M, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 1517-110M sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 70V |
|---|---|
| Type transistor: | NPN |
| Supplier aparato Package: | 55AW-1 |
| serye: | - |
| Power - Max: | 350W |
| packaging: | Bulk |
| Package / Kaso: | 55AW-1 |
| operating Temperature: | - |
| Noise Figure (DB Typ @ f): | - |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | 1517-110M |
| pakinabang: | 7.3dB ~ 8.6dB |
| Frequency - Transition: | 1.48GHz ~ 1.65GHz |
| Ang pinalawak Paglalarawan: | RF Transistor NPN 70V 9A 1.48GHz ~ 1.65GHz 350W Chassis Mount 55AW-1 |
| paglalarawan: | TRANS RF BIPO 350W 9A 55AW1 |
| DC Kasalukuyang Gain (HFE) (Min) @ Ic, Vce: | 20 @ 1A, 5V |
| Current - kolektor (Ic) (Max): | 9A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 1517-110M
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
55GN01MA-TL-E | ON Semiconductor | TRANS NPN BIPO 70MA 10V MCP | Pagtatanong |
 |
SD1728 | STMicroelectronics | TRANSISTOR NPN RF HF SSB M177 | Pagtatanong |
 |
PN3563_D75Z | Fairchild/ON Semiconductor | TRANS RF NPN 15V 50MA TO-92 | Pagtatanong |
 |
1517-20M | Microsemi Corporation | TRANS RF BIPO 175W 3A 55LV1 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers