Bumili 1812L035/30DR sa BYCHPS
Bumili na may garantiya
1812L035/30DR
- Numero ng Bahagi:
- 1812L035/30DR
- Manufacturer:
- Littelfuse
- Paglalarawan:
- FUSE PTC RESET .35A 30V 1812
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14810 Pieces
- Data sheet:
- 1812L035/30DR.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 1812L035/30DR, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 1812L035/30DR sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Max: | 30V |
|---|---|
| uri: | Polymeric |
| Oras upang Trip: | 150ms |
| Kapal (Max): | 0.049" (1.25mm) |
| Sukat / Dimension: | 0.179" L x 0.128" W (4.55mm x 3.24mm) |
| serye: | POLY-FUSE®, 1812L |
| Resistance - Post Trip (R1) (Max): | 1.7 Ohm |
| Resistance - Inisyal (Ri) (Min): | 400 mOhm |
| Resistance - 25 ° C (Typ): | - |
| Ratings: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1812 (4532 Metric), Concave |
| Ibang pangalan: | 1812L035/30 1812L035/30DR-ND 1812L03530DR F4158TR |
| operating Temperature: | -40°C ~ 85°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | 1812L035/30DR |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | - |
| Ang pinalawak Paglalarawan: | PTC Resettable Fuse 30V Ih Surface Mount 1812 (4532 Metric), Concave |
| paglalarawan: | FUSE PTC RESET .35A 30V 1812 |
| Current - Trip (Ito): | 750mA |
| Current - Max: | 40A |
| Current - Hold (Ih) (Max): | 350mA |
| Mga Pag-apruba: | cURus, TUV |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 1812L035/30DR
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers