Bumili 27E460 sa BYCHPS
Bumili na may garantiya
27E460
- Numero ng Bahagi:
- 27E460
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- SOCKET SCREW TERM DP R10 RELAYS
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13680 Pieces
- Data sheet:
- 27E460.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 27E460, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 27E460 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Socket |
|---|---|
| pagwawakas Style: | Screw Terminal |
| serye: | R10 |
| Ibang pangalan: | 1393837-1 PB640 |
| Bilang ng Posisyon: | 10 |
| Salalayan Type: | Chassis Mount |
| Tagagawa Standard Lead Time: | 14 Weeks |
| Manufacturer Bilang Bahagi: | 27E460 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | R10 Series |
| Mga tampok: | Without Grounding |
| Ang pinalawak Paglalarawan: | Relay Socket Chassis Mount |
| paglalarawan: | SOCKET SCREW TERM DP R10 RELAYS |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 27E460
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
AT8-RFV | Panasonic Industrial Automation Sales | RELAY SOCKET 10AMP FEMALE | Pagtatanong |
 |
JRS200201 | Amphenol PCD | QUICK MOUNT, 2 POLE WC | Pagtatanong |
 |
27E462 | TE Connectivity Potter & Brumfield Relays | SOCKET SCREW TERM 6P R10 RELAYS | Pagtatanong |
 |
18830 | Curtis Industries | RELAY SOCKET | Pagtatanong |
 |
2946777 | Phoenix Contact | RELAY MODULE WITH PLUG-IN BASE | Pagtatanong |
|
RSE120165 | Amphenol PCD | LOW PROFILE, 2 POLE/5 AMP, WC | Pagtatanong |
 |
27E461 | TE Connectivity Potter & Brumfield Relays | SOCKET SCREW TERM 4P R10 RELAYS | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers