Bumili 35SEPF82M+TSS sa BYCHPS
Bumili na may garantiya
35SEPF82M+TSS
- Numero ng Bahagi:
- 35SEPF82M+TSS
- Manufacturer:
- Panasonic
- Paglalarawan:
- CAP ALUM POLY 82UF 20% 35V T/H
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19873 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 35SEPF82M+TSS, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 35SEPF82M+TSS sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 35V |
|---|---|
| uri: | Polymer |
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | - |
| Sukat / Dimension: | 0.315" Dia (8.00mm) |
| serye: | OS-CON™, SEPF |
| Ripple Kasalukuyang - Mababang Dalas: | 200mA @ 120Hz |
| Ripple Kasalukuyang - Mataas na Dalas: | 4A @ 100kHz |
| packaging: | Tape & Box (TB) |
| Package / Kaso: | Radial, Can |
| Ibang pangalan: | P16408TB |
| operating Temperature: | -55°C ~ 105°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | 35SEPF82M+TSS |
| Lifetime @ Temp.: | 5000 Hrs @ 105°C |
| Lead Spacing: | 0.138" (3.50mm) |
| impedance: | - |
| Taas - Makaupo (Max): | 0.472" (12.00mm) |
| Ang pinalawak Paglalarawan: | 82µF ±20% 35V Aluminum Polymer Capacitor Radial, Can 20 mOhm 5000 Hrs @ 105°C |
| ESR (Katumbas Series pagtutol): | 20 mOhm |
| paglalarawan: | CAP ALUM POLY 82UF 20% 35V T/H |
| kapasidad: | 82µF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 35SEPF82M+TSS
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers