Bumili 36502A1R2JTDG sa BYCHPS
Bumili na may garantiya
36502A1R2JTDG
- Numero ng Bahagi:
- 36502A1R2JTDG
- Manufacturer:
- AMP Connectors / TE Connectivity
- Paglalarawan:
- FIXED IND 1.2UH 170MA 2.5 OHM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16611 Pieces
- Data sheet:
- 1.36502A1R2JTDG.pdf2.36502A1R2JTDG.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 36502A1R2JTDG, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 36502A1R2JTDG sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Wirewound |
|---|---|
| pagpapaubaya: | ±5% |
| Supplier aparato Package: | 0907 (2317 Metric) |
| Sukat / Dimension: | 0.090" L x 0.068" W (2.29mm x 1.73mm) |
| shielding: | Unshielded |
| serye: | 3650, Sigma Inductors |
| Ratings: | - |
| Q @ Freq: | 18 @ 25MHz |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | Nonstandard |
| Ibang pangalan: | 6-1624113-8 616241138 A103771TR |
| operating Temperature: | -40°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | - |
| Tagagawa Standard Lead Time: | 6 Weeks |
| Manufacturer Bilang Bahagi: | 36502A1R2JTDG |
| inductance: | 1.2µH |
| Taas - Makaupo (Max): | 0.060" (1.52mm) |
| Frequency - Test: | 250MHz |
| Frequency - Self Resonant: | 100MHz |
| Ang pinalawak Paglalarawan: | 1.2µH Unshielded Wirewound Inductor 170mA 2.5 Ohm Max Nonstandard |
| paglalarawan: | FIXED IND 1.2UH 170MA 2.5 OHM |
| DC pagtutol (DCR): | 2.5 Ohm Max |
| kasalukuyang Rating: | 170mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 36502A1R2JTDG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers