Bumili 72V263L7-5PF sa BYCHPS
Bumili na may garantiya
72V263L7-5PF
- Numero ng Bahagi:
- 72V263L7-5PF
- Manufacturer:
- IDT (Integrated Device Technology)
- Paglalarawan:
- IC FIFO 8192X18 7-5NS 80QFP
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 12896 Pieces
- Data sheet:
- 1.72V263L7-5PF.pdf2.72V263L7-5PF.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 72V263L7-5PF, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 72V263L7-5PF sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 3.15 V ~ 3.45 V |
|---|---|
| Supplier aparato Package: | 80-TQFP (14x14) |
| serye: | 72V |
| muling ipadala Capability: | Yes |
| Programmable Flags Support: | Yes |
| packaging: | Tray |
| Package / Kaso: | 80-LQFP |
| Ibang pangalan: | IDT72V263L7-5PF IDT72V263L7-5PF-ND |
| operating Temperature: | 0°C ~ 70°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Size memory: | 144K (8K x 18)(16K x 9) |
| Tagagawa Standard Lead Time: | 7 Weeks |
| Manufacturer Bilang Bahagi: | 72V263L7-5PF |
| tungkulin: | Synchronous |
| FWFT Support: | Yes |
| Type expansion: | Depth, Width |
| paglalarawan: | IC FIFO 8192X18 7-5NS 80QFP |
| Rate data: | 133.3MHz |
| Current - Supply (Max): | 35mA |
| bus Directional: | Uni-Directional |
| Access Time: | 5ns |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 72V263L7-5PF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers