Bumili 74ABTH162245ADGG:1 sa BYCHPS
Bumili na may garantiya
74ABTH162245ADGG:1
- Numero ng Bahagi:
- 74ABTH162245ADGG:1
- Manufacturer:
- Nexperia
- Paglalarawan:
- IC BUS TXRX 16BIT TRI-ST 48TSSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18770 Pieces
- Data sheet:
- 74ABTH162245ADGG:1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 74ABTH162245ADGG:1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 74ABTH162245ADGG:1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 4.5 V ~ 5.5 V |
|---|---|
| Supplier aparato Package: | 48-TSSOP |
| serye: | 74ABTH |
| packaging: | Tube |
| Package / Kaso: | 48-TFSOP (0.240", 6.10mm Width) |
| Type output: | Push-Pull |
| Ibang pangalan: | 935228890112 |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng mga Sangkap: | 2 |
| Bilang ng mga Bits per Element: | 8 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | 74ABTH162245ADGG:1 |
| logic Type: | Transceiver, Non-Inverting |
| Type input: | - |
| Ang pinalawak Paglalarawan: | Transceiver, Non-Inverting Element 8 Bit per Element Push-Pull Output 48-TSSOP |
| paglalarawan: | IC BUS TXRX 16BIT TRI-ST 48TSSOP |
| Current - Output Mataas, Mababa: | 32mA, 12mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 74ABTH162245ADGG:1
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
74ABTH162245ADL:11 | Nexperia USA Inc. | IC TRANSCVR TRI-ST 8BIT 48SSOP | Pagtatanong |
 |
74ABTH162245ADGG,5 | Nexperia USA Inc. | IC TRANSCVR TRI-ST 8BIT 48TSSOP | Pagtatanong |
|
74ABTH162245ADGG,1 | Nexperia USA Inc. | IC BUS TXRX 16BIT TRI-ST 48TSSOP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers