Bumili 74LVC07APW,112 sa BYCHPS
Bumili na may garantiya
74LVC07APW,112
- Numero ng Bahagi:
- 74LVC07APW,112
- Manufacturer:
- Nexperia
- Paglalarawan:
- IC BUFF HEX OPEN DRAIN 14TSSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16187 Pieces
- Data sheet:
- 74LVC07APW,112.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 74LVC07APW,112, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 74LVC07APW,112 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1.2 V ~ 5.5 V |
|---|---|
| Supplier aparato Package: | 14-TSSOP |
| serye: | 74LVC |
| packaging: | Tube |
| Package / Kaso: | 14-TSSOP (0.173", 4.40mm Width) |
| Type output: | Open Drain |
| Ibang pangalan: | 1727-6456 568-8310-5 568-8310-5-ND 74LVC07APW 74LVC07APW,112-ND 74LVC07APW-ND 935265482112 |
| operating Temperature: | -40°C ~ 125°C (TA) |
| Bilang ng mga Sangkap: | 6 |
| Bilang ng mga Bits per Element: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | 74LVC07APW,112 |
| logic Type: | Buffer, Non-Inverting |
| Type input: | - |
| Ang pinalawak Paglalarawan: | Buffer, Non-Inverting Element 1 Bit per Element Open Drain Output 14-TSSOP |
| paglalarawan: | IC BUFF HEX OPEN DRAIN 14TSSOP |
| Current - Output Mataas, Mababa: | -, 32mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 74LVC07APW,112
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers