Bumili 80VXG3900MEFC30X45 sa BYCHPS
Bumili na may garantiya
80VXG3900MEFC30X45
- Numero ng Bahagi:
- 80VXG3900MEFC30X45
- Manufacturer:
- Rubycon
- Paglalarawan:
- CAP ALUM 3900UF 20% 80V SNAP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19210 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 80VXG3900MEFC30X45, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 80VXG3900MEFC30X45 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 80V |
|---|---|
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | - |
| Sukat / Dimension: | 1.181" Dia (30.00mm) |
| serye: | VXG |
| Ripple Kasalukuyang: | 2.94A @ 120Hz |
| polariseysyon: | Polar |
| packaging: | Bulk |
| Package / Kaso: | Radial, Can - Snap-In |
| operating Temperature: | -40°C ~ 105°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | 80VXG3900MEFC30X45 |
| Lifetime @ Temp.: | 5000 Hrs @ 105°C |
| Lead Spacing: | 0.394" (10.00mm) |
| impedance: | - |
| Taas - Makaupo (Max): | 1.850" (47.00mm) |
| Ang pinalawak Paglalarawan: | 3900µF 80V Aluminum Capacitors Radial, Can - Snap-In 5000 Hrs @ 105°C |
| ESR (Katumbas Series pagtutol): | - |
| paglalarawan: | CAP ALUM 3900UF 20% 80V SNAP |
| kapasidad: | 3900µF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 80VXG3900MEFC30X45
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers