Bumili AIMC-0805-22NJ-T sa BYCHPS
Bumili na may garantiya
AIMC-0805-22NJ-T
- Numero ng Bahagi:
- AIMC-0805-22NJ-T
- Manufacturer:
- Abracon Corporation
- Paglalarawan:
- FIXED IND 22NH 300MA 500 MOHM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12412 Pieces
- Data sheet:
- 1.AIMC-0805-22NJ-T.pdf2.AIMC-0805-22NJ-T.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa AIMC-0805-22NJ-T, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa AIMC-0805-22NJ-T sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Multilayer |
|---|---|
| pagpapaubaya: | ±5% |
| Supplier aparato Package: | 0805 (2012 Metric) |
| Sukat / Dimension: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| shielding: | Unshielded |
| serye: | AIMC-0805 |
| Ratings: | - |
| Q @ Freq: | 15 @ 100MHz |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 0805 (2012 Metric) |
| Ibang pangalan: | 535-11560-2 AIMC-0805-22NJ-T-ND AIMC080522NJT |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ceramic |
| Tagagawa Standard Lead Time: | 11 Weeks |
| Manufacturer Bilang Bahagi: | AIMC-0805-22NJ-T |
| inductance: | 22nH |
| Taas - Makaupo (Max): | 0.041" (1.05mm) |
| Frequency - Test: | 100MHz |
| Frequency - Self Resonant: | 1.4GHz |
| Ang pinalawak Paglalarawan: | 22nH Unshielded Multilayer Inductor 300mA 500 mOhm Max 0805 (2012 Metric) |
| paglalarawan: | FIXED IND 22NH 300MA 500 MOHM |
| DC pagtutol (DCR): | 500 mOhm Max |
| kasalukuyang Rating: | 300mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa AIMC-0805-22NJ-T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers