Bumili AISC-1008-6R8G-T sa BYCHPS
Bumili na may garantiya
AISC-1008-6R8G-T
- Numero ng Bahagi:
- AISC-1008-6R8G-T
- Manufacturer:
- Abracon Corporation
- Paglalarawan:
- FIXED IND 6.8UH 200MA 7.7 OHM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14812 Pieces
- Data sheet:
- 1.AISC-1008-6R8G-T.pdf2.AISC-1008-6R8G-T.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa AISC-1008-6R8G-T, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa AISC-1008-6R8G-T sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Wirewound |
|---|---|
| pagpapaubaya: | ±2% |
| Supplier aparato Package: | 1008 (2520 Metric) |
| Sukat / Dimension: | 0.115" L x 0.110" W (2.92mm x 2.79mm) |
| shielding: | Unshielded |
| serye: | AISC-1008 |
| Ratings: | - |
| Q @ Freq: | 20 @ 25MHz |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1008 (2520 Metric) |
| Ibang pangalan: | AISC-1008-6R8G-TTR AISC10086R8GT |
| operating Temperature: | -40°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ceramic |
| Tagagawa Standard Lead Time: | 11 Weeks |
| Manufacturer Bilang Bahagi: | AISC-1008-6R8G-T |
| inductance: | 6.8µH |
| Taas - Makaupo (Max): | 0.090" (2.29mm) |
| Frequency - Test: | 7.9MHz |
| Frequency - Self Resonant: | 40MHz |
| Ang pinalawak Paglalarawan: | 6.8µH Unshielded Wirewound Inductor 200mA 7.7 Ohm Max 1008 (2520 Metric) |
| paglalarawan: | FIXED IND 6.8UH 200MA 7.7 OHM |
| DC pagtutol (DCR): | 7.7 Ohm Max |
| kasalukuyang Rating: | 200mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa AISC-1008-6R8G-T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers