Bumili BDZW9 sa BYCHPS
Bumili na may garantiya
BDZW9
- Numero ng Bahagi:
- BDZW9
- Manufacturer:
- Bussmann (Eaton)
- Paglalarawan:
- CONVERSION KIT 400-800A 6OR8POS
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18802 Pieces
- Data sheet:
- BDZW9.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BDZW9, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BDZW9 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe: | - |
|---|---|
| uri: | Conversion Kit |
| serye: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | BDZW9 |
| paglalarawan: | CONVERSION KIT 400-800A 6OR8POS |
| kasalukuyan: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BDZW9
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
BDZW3 | Eaton | CONVERSION KIT 400A-1200A | Pagtatanong |
|
BDZW2 | Eaton | CONVERSION KIT 60-200A 6OR8POS | Pagtatanong |
|
H4X-04B | Eaton | SWITCH COMPONENT HANDLE BLACK | Pagtatanong |
|
BDNF175A4 | Eaton | SWITCH NON-FUS 4POLE 175A | Pagtatanong |
|
BDZW5 | Eaton | CONVERSION KIT 30A 6POS | Pagtatanong |
|
BDZW30 | Eaton | CONVERSION KIT 3POS TRANSFER | Pagtatanong |
|
DIR-06 | Eaton | SWITCH COMPONENT HANDLE BLACK | Pagtatanong |
|
BDZW13 | Eaton | CONVERSION KIT 400-1200A 6OR8POS | Pagtatanong |
|
BDH120 | Eaton | HANDLE PISTOL BLACK FOR SWITCH | Pagtatanong |
|
BDZW95 | Eaton | SHAFT EXTENSION COUPLER 12MM | Pagtatanong |
|
TPWDS-BBM-3 | Eaton | SWITCH DISCONNECT 150-250A 80VDC | Pagtatanong |
|
BDZW12 | Eaton | CONVERSION KIT 400-1200A 6OR8POS | Pagtatanong |
|
BDZW1 | Eaton | CONVERSION KIT 60-100A TRANSFER | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers