Bumili BFR 360F E6765 sa BYCHPS
Bumili na may garantiya
BFR 360F E6765
- Numero ng Bahagi:
- BFR 360F E6765
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Paglalarawan:
- TRANSISTOR NPN RF 6V TSFP-3
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13549 Pieces
- Data sheet:
- BFR 360F E6765.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BFR 360F E6765, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BFR 360F E6765 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 9V |
|---|---|
| Type transistor: | NPN |
| Supplier aparato Package: | PG-TSFP-3 |
| serye: | - |
| Power - Max: | 210mW |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | SOT-723 |
| Ibang pangalan: | BFR 360F E6765-ND SP000012980 |
| operating Temperature: | 150°C (TJ) |
| Noise Figure (DB Typ @ f): | 1dB @ 1.8GHz |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | BFR 360F E6765 |
| pakinabang: | 15.5dB |
| Frequency - Transition: | 14GHz |
| Ang pinalawak Paglalarawan: | RF Transistor NPN 9V 35mA 14GHz 210mW Surface Mount PG-TSFP-3 |
| paglalarawan: | TRANSISTOR NPN RF 6V TSFP-3 |
| DC Kasalukuyang Gain (HFE) (Min) @ Ic, Vce: | 90 @ 15mA, 3V |
| Current - kolektor (Ic) (Max): | 35mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BFR 360F E6765
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers