Bumili BO4-08 sa BYCHPS
Bumili na may garantiya
BO4-08
- Numero ng Bahagi:
- BO4-08
- Manufacturer:
- Bussmann (Eaton)
- Paglalarawan:
- FUSEHOLDER CAP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18275 Pieces
- Data sheet:
- BO4-08.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BO4-08, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BO4-08 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | - |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | BO4-08 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | A4000 Series |
| paglalarawan: | FUSEHOLDER CAP |
| accessory Type: | Cap (Cover) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BO4-08
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
09050023H | Littelfuse Inc. | FUSE LOCKWASHER ACS | Pagtatanong |
 |
BO4-04BF | Eaton | FUSEHOLDER CAP | Pagtatanong |
|
BO4-03BF | Eaton | FUSEHOLDER CAP | Pagtatanong |
 |
US6J3PAK | Littelfuse Inc. | ACS LPSJ 60A 3 POLE ASSEMBLY KIT | Pagtatanong |
|
BO4-04 | Eaton | FUSEHOLDER CAP | Pagtatanong |
 |
84-006 | TE Connectivity Potter & Brumfield Relays | TOGGLE GUARD | Pagtatanong |
|
00-001-026-32/J | Eaton | FOOTED BASE BE | Pagtatanong |
|
BO4-06BF | Eaton | FUSEHOLDER CAP | Pagtatanong |
|
BO4-03 | Eaton | FUSEHOLDER CAP | Pagtatanong |
|
GV2G245A46 | Eaton | FUSEHOLDER BUSS BAR | Pagtatanong |
|
0CBF030.S | Littelfuse Inc. | CBK FUSE CLIP CIRCUIT BRKR 30A | Pagtatanong |
|
BO4-05 | Eaton | FUSEHOLDER CAP | Pagtatanong |
|
BO4-02 | Eaton | FUSEHOLDER CAP | Pagtatanong |
|
BO4-08BF | Eaton | FUSEHOLDER CAP | Pagtatanong |
|
BO4-12 | Eaton | FUSEHOLDER CAP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers