Bumili BU94501AKS2-E2 sa BYCHPS
Bumili na may garantiya
BU94501AKS2-E2
- Numero ng Bahagi:
- BU94501AKS2-E2
- Manufacturer:
- LAPIS Semiconductor
- Paglalarawan:
- IC USB AUDIO DECODER 52SQFP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13343 Pieces
- Data sheet:
- BU94501AKS2-E2.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BU94501AKS2-E2, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BU94501AKS2-E2 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply, Digital: | - |
|---|---|
| Boltahe - Supply, Analog: | 3 V ~ 3.6 V |
| uri: | - |
| Supplier aparato Package: | SQFP-T52M (10x10) |
| serye: | - |
| packaging: | Original-Reel® |
| Package / Kaso: | 52-LQFP |
| Ibang pangalan: | BU94501AKS2-E2DKR |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | BU94501AKS2-E2 |
| Ang pinalawak Paglalarawan: | IC Audio SQFP-T52M (10x10) |
| paglalarawan: | IC USB AUDIO DECODER 52SQFP |
| aplikasyon: | Audio |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BU94501AKS2-E2
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
BU94502AMUV-E2 | Rohm Semiconductor | IC DECODER USB AUDIO 40-VQFN | Pagtatanong |
 |
BU94502AKS2-E2 | Rohm Semiconductor | IC DECODER USB AUDIO 52-SQFP | Pagtatanong |
|
BU9450KV-E2 | Rohm Semiconductor | IC USB HOST MP3 DECODER VQFP | Pagtatanong |
|
BU9451KV-E2 | Rohm Semiconductor | IC DECODER USB HOST AUDIO 64LQFP | Pagtatanong |
 |
BU94501AMUV-E2 | Rohm Semiconductor | IC DECODER USB AUDIO 40-VQFN | Pagtatanong |
 |
BU9457KV-E2 | Rohm Semiconductor | IC DECODER USB HOST AUDIO 64LQFP | Pagtatanong |
|
BU9458KV-E2 | Rohm Semiconductor | IC DECODER USB HOST AUDIO 64LQFP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers