Bumili CENGPXA270-416-10-550HIR sa BYCHPS
Bumili na may garantiya
CENGPXA270-416-10-550HIR
- Numero ng Bahagi:
- CENGPXA270-416-10-550HIR
- Manufacturer:
- Logic PD, Inc.
- Paglalarawan:
- CARD ENGING 64MB SDRAM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16903 Pieces
- Data sheet:
- CENGPXA270-416-10-550HIR.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa CENGPXA270-416-10-550HIR, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa CENGPXA270-416-10-550HIR sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| bilis: | 416MHz |
|---|---|
| Sukat / Dimension: | 2.37" x 2.67" (60.2mm x 67.8mm) |
| serye: | - |
| RAM Size: | 64MB |
| operating Temperature: | -40°C ~ 85°C |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Module / Uri Board: | MCU Core |
| Manufacturer Bilang Bahagi: | CENGPXA270-416-10-550HIR |
| Flash Size: | 64MB |
| Ang pinalawak Paglalarawan: | - Embedded Module PXA270 416MHz 64MB 64MB |
| paglalarawan: | CARD ENGING 64MB SDRAM |
| core Processor: | PXA270 |
| Type connector: | SO-DIMM-144 |
| Co-Processor: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa CENGPXA270-416-10-550HIR
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers