Bumili CGA3E1X7R1V684M080AC sa BYCHPS
Bumili na may garantiya
CGA3E1X7R1V684M080AC
- Numero ng Bahagi:
- CGA3E1X7R1V684M080AC
- Manufacturer:
- TDK Corporation
- Paglalarawan:
- CAP CER 0.68UF 35V X7R 0603
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13875 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa CGA3E1X7R1V684M080AC, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa CGA3E1X7R1V684M080AC sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 35V |
|---|---|
| pagpapaubaya: | ±20% |
| Kapal (Max): | 0.035" (0.90mm) |
| temperatura koepisyent: | X7R |
| Sukat / Dimension: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
| serye: | CGA |
| Ratings: | AEC-Q200 |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 0603 (1608 Metric) |
| Ibang pangalan: | CGA3E1X7R1V684MT000N |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 20 Weeks |
| Manufacturer Bilang Bahagi: | CGA3E1X7R1V684M080AC |
| Lead Style: | - |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | - |
| Mga tampok: | - |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 0.68µF ±20% 35V Ceramic Capacitor X7R 0603 (1608 Metric) |
| paglalarawan: | CAP CER 0.68UF 35V X7R 0603 |
| kapasidad: | 0.68µF |
| aplikasyon: | Automotive |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa CGA3E1X7R1V684M080AC
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers