Bumili DMT6009LPS-13 sa BYCHPS
Bumili na may garantiya
DMT6009LPS-13
- Numero ng Bahagi:
- DMT6009LPS-13
- Manufacturer:
- Diodes Incorporated
- Paglalarawan:
- MOSFET N-CHA 60V 10.6A POWERDI
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13565 Pieces
- Data sheet:
- DMT6009LPS-13.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DMT6009LPS-13, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DMT6009LPS-13 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 2V @ 250µA |
|---|---|
| Vgs (Max): | ±16V |
| teknolohiya: | MOSFET (Metal Oxide) |
| Supplier aparato Package: | PowerDI5060-8 |
| serye: | Automotive, AEC-Q101 |
| Rds On (Max) @ Id, Vgs: | 10 mOhm @ 20A, 10V |
| Power pagwawaldas (Max): | 2.3W (Ta) |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 8-PowerTDFN |
| Ibang pangalan: | DMT6009LPS-13DITR |
| operating Temperature: | -55°C ~ 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | DMT6009LPS-13 |
| Input Kapasidad (Ciss) (Max) @ Vds: | 1925pF @ 30V |
| Gate Charge (Qg) (Max) @ Vgs: | 33.5nC @ 10V |
| Type FET: | N-Channel |
| FET Tampok: | - |
| Ang pinalawak Paglalarawan: | N-Channel 60V 10.6A (Ta), 87A (Tc) 2.3W (Ta) Surface Mount PowerDI5060-8 |
| Drive Boltahe (Max Rds On, Min Rds On): | 4.5V, 10V |
| Alisan ng tubig sa Source Boltahe (Vdss): | 60V |
| paglalarawan: | MOSFET N-CHA 60V 10.6A POWERDI |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 10.6A (Ta), 87A (Tc) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DMT6009LPS-13
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers