Bumili DNA30E2200PA sa BYCHPS
Bumili na may garantiya
DNA30E2200PA
- Numero ng Bahagi:
- DNA30E2200PA
- Manufacturer:
- IXYS Corporation
- Paglalarawan:
- DIODE GEN PURP 2.2KV 30A TO220AC
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19773 Pieces
- Data sheet:
- DNA30E2200PA.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DNA30E2200PA, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DNA30E2200PA sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Forward (Vf) (Max) @ Kung: | 1.26V @ 30A |
|---|---|
| Boltahe - DC Reverse (Vr) (Max): | 2200V (2.2kV) |
| Supplier aparato Package: | TO-220AC |
| bilis: | Standard Recovery >500ns, > 200mA (Io) |
| serye: | - |
| packaging: | Tube |
| Package / Kaso: | TO-220-2 |
| Operating Temperature - Junction: | -55°C ~ 175°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | DNA30E2200PA |
| Ang pinalawak Paglalarawan: | Diode Standard 2200V (2.2kV) 30A Through Hole TO-220AC |
| Type diode: | Standard |
| paglalarawan: | DIODE GEN PURP 2.2KV 30A TO220AC |
| Current - Reverse pagtagas @ Vr: | 40µA @ 2200V |
| Kasalukuyang - Average rectified (Io): | 30A |
| Kapasidad @ Vr, F: | 7pF @ 700V, 1MHz |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DNA30E2200PA
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
DNA30E2200PZ | IXYS | DIODE RECT 2200V 30A D2PAK-HV | Pagtatanong |
 |
DNA30EM2200PC | IXYS | DIODE GEN PURP 2.2KV 30A TO263 | Pagtatanong |
|
DNA30E2200PC | IXYS | DIODE GEN PURP 2.2KV 30A TO263 | Pagtatanong |
|
DNA30E2200PC-TUB | IXYS | DIODE GEN PURP 2.2KV 30A TO263 | Pagtatanong |
 |
DNA30E2200FE | IXYS | DIODE GEN PURP 2.2KV 30A I4PAC | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers