Bumili DSPIC33EP512MU814-I/PH sa BYCHPS
Bumili na may garantiya
DSPIC33EP512MU814-I/PH
- Numero ng Bahagi:
- DSPIC33EP512MU814-I/PH
- Manufacturer:
- Micrel / Microchip Technology
- Paglalarawan:
- IC MCU 16BIT 512KB FLASH 144TQFP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 20207 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DSPIC33EP512MU814-I/PH, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DSPIC33EP512MU814-I/PH sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 3 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 144-TQFP (16x16) |
| bilis: | 70 MIPs |
| serye: | dsPIC™ 33EP |
| RAM Size: | 24K x 16 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 512KB (170K x 24) |
| Peripherals: | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT |
| packaging: | Tray |
| Package / Kaso: | 144-TQFP |
| Ibang pangalan: | DSPIC33EP512MU814IPH |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 122 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 13 Weeks |
| Manufacturer Bilang Bahagi: | DSPIC33EP512MU814-I/PH |
| Ang pinalawak Paglalarawan: | dsPIC dsPIC™ 33EP Microcontroller IC 16-Bit 70 MIPs 512KB (170K x 24) FLASH 144-TQFP (16x16) |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 16BIT 512KB FLASH 144TQFP |
| data Converters: | A/D 32x10b/12b |
| core Size: | 16-Bit |
| core Processor: | dsPIC |
| Connectivity: | CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DSPIC33EP512MU814-I/PH
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers