Bumili ECW-F6364HLB sa BYCHPS
Bumili na may garantiya
ECW-F6364HLB
- Numero ng Bahagi:
- ECW-F6364HLB
- Manufacturer:
- Panasonic
- Paglalarawan:
- CAP FILM 0.36UF 3% 630VDC RADIAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16081 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa ECW-F6364HLB, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa ECW-F6364HLB sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe Rating - DC: | 630V |
|---|---|
| Boltahe Rating - AC: | - |
| pagpapaubaya: | ±3% |
| pagwawakas: | PC Pins |
| Sukat / Dimension: | 0.807" L x 0.469" W (20.50mm x 11.90mm) |
| serye: | ECW-F(L) |
| packaging: | Bulk |
| Package / Kaso: | Radial |
| Ibang pangalan: | ECWF6364HLB |
| operating Temperature: | -40°C ~ 105°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Bilang Bahagi: | ECW-F6364HLB |
| Lead Spacing: | 0.492" (12.50mm) |
| Taas - Makaupo (Max): | 0.925" (23.50mm) |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | 0.36µF ±3% Film Capacitor 630V Polypropylene (PP), Metallized Radial |
| ESR (Katumbas Series pagtutol): | - |
| dielectric Material: | Polypropylene (PP), Metallized |
| paglalarawan: | CAP FILM 0.36UF 3% 630VDC RADIAL |
| kapasidad: | 0.36µF |
| aplikasyon: | High Frequency, Switching |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa ECW-F6364HLB
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers