Bumili EPC2103ENG sa BYCHPS
Bumili na may garantiya
EPC2103ENG
- Numero ng Bahagi:
- EPC2103ENG
- Manufacturer:
- EPC
- Paglalarawan:
- TRANS GAN 2N-CH 80V BUMPED DIE
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19334 Pieces
- Data sheet:
- EPC2103ENG.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa EPC2103ENG, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa EPC2103ENG sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 2.5V @ 7mA |
|---|---|
| Supplier aparato Package: | Die |
| serye: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 5.5 mOhm @ 20A, 5V |
| Power - Max: | - |
| packaging: | Tray |
| Package / Kaso: | Die |
| Ibang pangalan: | 917-EPC2103ENG EPC2103ENGRH7 |
| operating Temperature: | -40°C ~ 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | EPC2103ENG |
| Input Kapasidad (Ciss) (Max) @ Vds: | 760pF @ 40V |
| Gate Charge (Qg) (Max) @ Vgs: | 6.5nC @ 5V |
| Type FET: | 2 N-Channel (Half Bridge) |
| FET Tampok: | GaNFET (Gallium Nitride) |
| Ang pinalawak Paglalarawan: | Mosfet Array 2 N-Channel (Half Bridge) 80V 23A Surface Mount Die |
| Alisan ng tubig sa Source Boltahe (Vdss): | 80V |
| paglalarawan: | TRANS GAN 2N-CH 80V BUMPED DIE |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 23A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa EPC2103ENG
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
EPC2104ENG | EPC | TRANS GAN 2N-CH 100V BUMPED DIE | Pagtatanong |
|
EPC2102ENGRT | EPC | MOSFET ARRAY 2N-CH 60V DIE | Pagtatanong |
 |
EPC2100ENGRT | EPC | MOSFET ARRAY 2N-CH 30V DIE | Pagtatanong |
 |
EPC2106ENGRT | EPC | TRANS GAN 2N-CH 100V BUMPED DIE | Pagtatanong |
|
EPC2103ENGRT | EPC | TRANS GAN SYM HALF BRDG 80V | Pagtatanong |
 |
EPC2108ENGRT | EPC | TRANS GAN 3N-CH BUMPED DIE | Pagtatanong |
|
EPC2104ENGRT | EPC | MOSFET 2NCH 100V 23A DIE | Pagtatanong |
|
EPC2101ENG | EPC | TRANS GAN 2N-CH 60V BUMPED DIE | Pagtatanong |
|
EPC2100ENG | EPC | TRANS GAN 2N-CH 30V BUMPED DIE | Pagtatanong |
|
EPC2102ENG | EPC | TRANS GAN 2N-CH 60V BUMPED DIE | Pagtatanong |
|
EPC2105ENGRT | EPC | MOSFET 2NCH 80V 9.5A DIE | Pagtatanong |
|
EPC2105ENG | EPC | TRANS GAN 2N-CH 80V BUMPED DIE | Pagtatanong |
 |
EPC2110ENGRT | EPC | TRANS GAN 2N-CH 120V BUMPED DIE | Pagtatanong |
|
EPC2107ENGRT | EPC | TRANS GAN 3N-CH 100V BUMPED DIE | Pagtatanong |
|
EPC2101ENGRT | EPC | TRANS GAN ASYMMETRICAL HALF BRID | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers