Bumili GDT8R526 sa BYCHPS
Bumili na may garantiya
GDT8R526
- Numero ng Bahagi:
- GDT8R526
- Manufacturer:
- Sprague Goodman
- Paglalarawan:
- CAP TRIM 1-8.5PF 250V THRU HOLE
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12034 Pieces
- Data sheet:
- GDT8R526.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa GDT8R526, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa GDT8R526 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 250V |
|---|---|
| Sukat / Dimension: | 0.311" Dia x 0.551" L (7.90mm x 14.00mm) |
| serye: | - |
| packaging: | Bulk |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | GDT8R526 |
| Taas - Makaupo (Max): | - |
| Mga tampok: | Sealed |
| Ang pinalawak Paglalarawan: | 1 ~ 8.5pF Trimmer Capacitor 250V Top Adjustment Through Hole |
| paglalarawan: | CAP TRIM 1-8.5PF 250V THRU HOLE |
| kapasidad Saklaw: | 1 ~ 8.5pF |
| Type adjustment: | Top Adjustment |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa GDT8R526
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
AM25HV | Knowles Voltronics | CAP TRIMMER 1-23PF 750V SMD | Pagtatanong |
 |
GDT8R531 | Sprague-Goodman | CAP TRIM 1-8.5PF 250V SURF MOUNT | Pagtatanong |
|
NMAM25HV | Knowles Voltronics | CAP TRIMMER 1-23PF 750V SMD | Pagtatanong |
|
GHR11000 | Sprague-Goodman | CAP TRIMMER TH | Pagtatanong |
 |
JZ300 | Knowles Voltronics | CAP TRIMMER 5.5-30PF 110V SMD | Pagtatanong |
 |
BFC280831229 | Vishay BC Components | CAP TRIM 3-22.5PF 150V THRU HOLE | Pagtatanong |
|
GNR4R500 | Sprague-Goodman | CAP TRIM 0.6-4.5PF 500V | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers