Bumili IMT3AT108 sa BYCHPS
Bumili na may garantiya
IMT3AT108
- Numero ng Bahagi:
- IMT3AT108
- Manufacturer:
- LAPIS Semiconductor
- Paglalarawan:
- TRANS 2PNP 50V 0.15A 6SMT
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19906 Pieces
- Data sheet:
- IMT3AT108.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa IMT3AT108, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa IMT3AT108 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 50V |
|---|---|
| Vce Saturation (Max) @ Ib, IC: | 500mV @ 5mA, 50mA |
| Type transistor: | 2 PNP (Dual) |
| Supplier aparato Package: | SMT6 |
| serye: | - |
| Power - Max: | 300mW |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | SC-74, SOT-457 |
| Ibang pangalan: | IMT3AT108-ND IMT3AT108TR |
| operating Temperature: | 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | IMT3AT108 |
| Frequency - Transition: | 140MHz |
| Ang pinalawak Paglalarawan: | Bipolar (BJT) Transistor Array 2 PNP (Dual) 50V 150mA 140MHz 300mW Surface Mount SMT6 |
| paglalarawan: | TRANS 2PNP 50V 0.15A 6SMT |
| DC Kasalukuyang Gain (HFE) (Min) @ Ic, Vce: | 120 @ 1mA, 6V |
| Current - Kolektor Cutoff (Max): | 100nA (ICBO) |
| Current - kolektor (Ic) (Max): | 150mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa IMT3AT108
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
CMKT5089M10 TR | Central Semiconductor Corp | TRANS 2NPN 25V 0.05A SOT363 | Pagtatanong |
 |
2N2480A | Central Semiconductor Corp | TRANS 2NPN 500MA 40V TO78-6 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers