Bumili IS61NLP25636A-200B3LI sa BYCHPS
Bumili na may garantiya
IS61NLP25636A-200B3LI
- Numero ng Bahagi:
- IS61NLP25636A-200B3LI
- Manufacturer:
- ISSI (Integrated Silicon Solution, Inc.)
- Paglalarawan:
- IC SRAM 9MBIT 200MHZ 165BGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14791 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa IS61NLP25636A-200B3LI, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa IS61NLP25636A-200B3LI sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 3.135 V ~ 3.465 V |
|---|---|
| Supplier aparato Package: | 165-TFBGA (13x15) |
| bilis: | 200MHz |
| serye: | - |
| packaging: | Tray |
| Package / Kaso: | 165-TFBGA |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Type memory: | Volatile |
| Size memory: | 9Mb (256K x 36) |
| memory Format: | SRAM |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | IS61NLP25636A-200B3LI |
| interface: | Parallel |
| paglalarawan: | IC SRAM 9MBIT 200MHZ 165BGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa IS61NLP25636A-200B3LI
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers