Bumili JTDB25 sa BYCHPS
Bumili na may garantiya
JTDB25
- Numero ng Bahagi:
- JTDB25
- Manufacturer:
- Microsemi
- Paglalarawan:
- TRANSISTOR BIPO 55AW-1
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13208 Pieces
- Data sheet:
- JTDB25.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa JTDB25, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa JTDB25 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 55V |
|---|---|
| Type transistor: | NPN |
| Supplier aparato Package: | 55AW-1 |
| serye: | - |
| Power - Max: | 97W |
| packaging: | Bulk |
| Package / Kaso: | 55AW-1 |
| operating Temperature: | 200°C (TJ) |
| Noise Figure (DB Typ @ f): | - |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | JTDB25 |
| pakinabang: | 7.5dB |
| Frequency - Transition: | 960MHz ~ 1.215GHz |
| Ang pinalawak Paglalarawan: | RF Transistor NPN 55V 5A 960MHz ~ 1.215GHz 97W Chassis Mount 55AW-1 |
| paglalarawan: | TRANSISTOR BIPO 55AW-1 |
| DC Kasalukuyang Gain (HFE) (Min) @ Ic, Vce: | 20 @ 500mA, 5V |
| Current - kolektor (Ic) (Max): | 5A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa JTDB25
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
BFG25A/X,215 | NXP USA Inc. | TRANS NPN 5V 5GHZ SOT143B | Pagtatanong |
 |
FMMT5179TA | Diodes Incorporated | TRANS RF NPN 12V 50MA SOT23-3 | Pagtatanong |
 |
2SC5086-Y,LF | Toshiba Semiconductor and Storage | TRANS RF NPN 12V 1MHZ SSM | Pagtatanong |
 |
15GN01MA-TL-E | ON Semiconductor | TRANS NPN BIPO 50MA 8V MCP | Pagtatanong |
 |
2N2857UB | Microsemi Corporation | TRANS NPN 15V 0.04A | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers