Bumili LAO-25V682MS26PX#B sa BYCHPS
Bumili na may garantiya
LAO-25V682MS26PX#B
- Numero ng Bahagi:
- LAO-25V682MS26PX#B
- Manufacturer:
- Elna America
- Paglalarawan:
- CAP ALUM 6800UF 20% 25V SNAP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17986 Pieces
- Data sheet:
- LAO-25V682MS26PX#B.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LAO-25V682MS26PX#B, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LAO-25V682MS26PX#B sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 25V |
|---|---|
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | - |
| Sukat / Dimension: | 0.866" Dia (22.00mm) |
| serye: | LAO, TONEREX |
| Ripple Kasalukuyang: | 2.2A @ 120Hz |
| polariseysyon: | Polar |
| packaging: | Bulk |
| Package / Kaso: | Radial, Can - Snap-In |
| Ibang pangalan: | 604-1094 LAO-25V682MPD1# LAO-25V682MPD1A# LAO-25V682MPDS1A# LAO-25V682MS1# LAO25V682MPDS1A# |
| operating Temperature: | -40°C ~ 85°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 22 Weeks |
| Manufacturer Bilang Bahagi: | LAO-25V682MS26PX#B |
| Lifetime @ Temp.: | 1000 Hrs @ 85°C |
| Lead Spacing: | 0.394" (10.00mm) |
| impedance: | - |
| Taas - Makaupo (Max): | 1.772" (45.00mm) |
| Ang pinalawak Paglalarawan: | 6800µF 25V Aluminum Capacitors Radial, Can - Snap-In 1000 Hrs @ 85°C |
| ESR (Katumbas Series pagtutol): | - |
| paglalarawan: | CAP ALUM 6800UF 20% 25V SNAP |
| kapasidad: | 6800µF |
| aplikasyon: | Audio |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LAO-25V682MS26PX#B
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers