Bumili LC75106V-TLM-H sa BYCHPS
Bumili na may garantiya
LC75106V-TLM-H
- Numero ng Bahagi:
- LC75106V-TLM-H
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Paglalarawan:
- IC ECHO LSI DGTL MIC AMP 36SSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17628 Pieces
- Data sheet:
- LC75106V-TLM-H.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LC75106V-TLM-H, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LC75106V-TLM-H sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 8 V ~ 10 V |
|---|---|
| Supplier aparato Package: | 36-SSOP |
| Mismong: | - |
| serye: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 36-LSOP (0.220", 5.60mm Width) |
| operating Temperature: | -20°C ~ 70°C (TA) |
| Bilang ng mga Channels: | 2 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 4 Weeks |
| Manufacturer Bilang Bahagi: | LC75106V-TLM-H |
| interface: | I²C |
| tungkulin: | Audio Signal Processor |
| Ang pinalawak Paglalarawan: | Audio Audio Signal Processor 2 Channel 36-SSOP |
| paglalarawan: | IC ECHO LSI DGTL MIC AMP 36SSOP |
| aplikasyon: | Signal Mixing |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LC75106V-TLM-H
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
BA3812L | Rohm Semiconductor | IC EQUALIZER GRAPHIC 5-CH ZIP18 | Pagtatanong |
 |
DRV134UA/1K | Texas Instruments | IC AUDIO DIFF LINE DRVR 16-SOIC | Pagtatanong |
 |
WM8804GEDS/RV | Cirrus Logic Inc. | IC TXRX S/PDIF 1:1 DGTL 20SSOP | Pagtatanong |
|
STA30613TR | STMicroelectronics | IC PROCESSOR AUD DGTL DDX 64TQFP | Pagtatanong |
 |
NJM2520D | NJR Corporation/NJRC | IC AUDIO SWITCH 2-IN/1-OUT 8-DIP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers