Bumili LPC2132FHN64,557 sa BYCHPS
Bumili na may garantiya
LPC2132FHN64,557
- Numero ng Bahagi:
- LPC2132FHN64,557
- Manufacturer:
- NXP Semiconductors / Freescale
- Paglalarawan:
- IC MCU 32BIT 64KB FLASH 64HVQFN
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13881 Pieces
- Data sheet:
- 1.LPC2132FHN64,557.pdf2.LPC2132FHN64,557.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LPC2132FHN64,557, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LPC2132FHN64,557 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 3 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 64-HVQFN (9x9) |
| bilis: | 60MHz |
| serye: | LPC2100 |
| RAM Size: | 16K x 8 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 64KB (64K x 8) |
| Peripherals: | Brown-out Detect/Reset, POR, PWM, WDT |
| packaging: | Tray |
| Package / Kaso: | 64-VFQFN Exposed Pad |
| Ibang pangalan: | 568-2243 935279883557 LPC2132FHN64 |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 47 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | LPC2132FHN64,557 |
| Ang pinalawak Paglalarawan: | ARM7® LPC2100 Microcontroller IC 16/32-Bit 60MHz 64KB (64K x 8) FLASH 64-HVQFN (9x9) |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 32BIT 64KB FLASH 64HVQFN |
| data Converters: | A/D 8x10b; D/A 1x10b |
| core Size: | 16/32-Bit |
| core Processor: | ARM7® |
| Connectivity: | I²C, Microwire, SPI, SSI, SSP, UART/USART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LPC2132FHN64,557
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers