Bumili LT6703HDC-3#TRMPBF sa BYCHPS
Bumili na may garantiya
LT6703HDC-3#TRMPBF
- Numero ng Bahagi:
- LT6703HDC-3#TRMPBF
- Manufacturer:
- L
- Paglalarawan:
- IC COMPARATOR 400MV REF 3-DFN
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17541 Pieces
- Data sheet:
- LT6703HDC-3#TRMPBF.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LT6703HDC-3#TRMPBF, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LT6703HDC-3#TRMPBF sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply, Single / Dual (±): | 1.4 V ~ 18 V |
|---|---|
| Boltahe - Input Offset (Max): | - |
| uri: | General Purpose |
| Supplier aparato Package: | 3-DFN (2x2) |
| serye: | Over-The-Top® |
| Propagation Delay (Max): | 29µs |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 3-WFDFN Exposed Pad |
| Type output: | Open Collector |
| Ibang pangalan: | LT6703HDC-3#TRMPBFTR LT6703HDC3TRMPBF |
| operating Temperature: | -40°C ~ 125°C |
| Bilang ng mga Sangkap: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 4 Weeks |
| Manufacturer Bilang Bahagi: | LT6703HDC-3#TRMPBF |
| hysteresis: | 13.5mV |
| Ang pinalawak Paglalarawan: | Comparator General Purpose Open Collector 3-DFN (2x2) |
| paglalarawan: | IC COMPARATOR 400MV REF 3-DFN |
| Current - namamahinga (Max): | 17µA |
| Current - Output (Typ): | - |
| Current - Input Bias (Max): | 0.01µA @ 18V |
| CMRR, PSRR (Typ): | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LT6703HDC-3#TRMPBF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers