Bumili M21605G-12 sa BYCHPS
Bumili na may garantiya
M21605G-12
- Numero ng Bahagi:
- M21605G-12
- Manufacturer:
- Aeroflex (MACOM Technology Solutions)
- Paglalarawan:
- 160X160 CROSSPOINT SWITCH 12.5GB
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12502 Pieces
- Data sheet:
- M21605G-12.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa M21605G-12, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa M21605G-12 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply, Single (V +): | 1.8V |
|---|---|
| Boltahe - Supply, Dual (V ±): | - |
| lumipat Circuit: | - |
| serye: | - |
| operating Temperature: | - |
| On-State Resistance (Max): | - |
| Bilang ng mga Channels: | 1 |
| Multiplexer / Demultiplexer Circuit: | 160:160 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | M21605G-12 |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | Backplane Switch IC 1 Channel |
| paglalarawan: | 160X160 CROSSPOINT SWITCH 12.5GB |
| aplikasyon: | Backplane |
| 3dB Bandwidth: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa M21605G-12
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
HA4314BCPZ | Intersil | IC VIDEO CROSSPOINT SWITCH 14DIP | Pagtatanong |
 |
HD3SS3212IRKST | Texas Instruments | IC MUX 2:1 8 OHM 20VQFN | Pagtatanong |
|
TS3L110PWRE4 | Texas Instruments | IC ETHERNET SWITCH QUAD 16TSSOP | Pagtatanong |
 |
HA4314BCAZ | Intersil | IC VIDEO CROSSPOINT SWIT 16QSOP | Pagtatanong |
 |
LT1203CS8#PBF | Linear Technology | IC VIDEO MULTIPLEXER SPDT 8SOIC | Pagtatanong |
 |
PEX8609-BA50BI G | Broadcom Limited | IC PCI EXPRESS SWITCH | Pagtatanong |
 |
MAX4566CSE+ | Maxim Integrated | IC VIDEO SWITCH DUAL SPST 16SOIC | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers