Bumili M306N4FGGP#U3 sa BYCHPS
Bumili na may garantiya
M306N4FGGP#U3
- Numero ng Bahagi:
- M306N4FGGP#U3
- Manufacturer:
- Renesas Electronics America
- Paglalarawan:
- IC MCU 16BIT 256KB FLASH 100QFP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17154 Pieces
- Data sheet:
- 1.M306N4FGGP#U3.pdf2.M306N4FGGP#U3.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa M306N4FGGP#U3, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa M306N4FGGP#U3 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 3 V ~ 5.5 V |
|---|---|
| Supplier aparato Package: | 100-LFQFP (14x14) |
| bilis: | 24MHz |
| serye: | M16C™ M16C/60/6N4 |
| RAM Size: | 10K x 8 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 256KB (256K x 8) |
| Peripherals: | DMA, WDT |
| packaging: | Tray |
| Package / Kaso: | 100-LQFP |
| Ibang pangalan: | M306N4FGGPU3 |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 85 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 24 Weeks |
| Manufacturer Bilang Bahagi: | M306N4FGGP#U3 |
| Ang pinalawak Paglalarawan: | M16C/60 M16C™ M16C/60/6N4 Microcontroller IC 16-Bit 24MHz 256KB (256K x 8) FLASH 100-LFQFP (14x14) |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 16BIT 256KB FLASH 100QFP |
| data Converters: | A/D 26x10b; D/A 2x8b |
| core Size: | 16-Bit |
| core Processor: | M16C/60 |
| Connectivity: | CAN, I²C, IEBus, SIO, UART/USART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa M306N4FGGP#U3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers