Bumili MAX6225AEPA+ sa BYCHPS
Bumili na may garantiya
MAX6225AEPA+
- Numero ng Bahagi:
- MAX6225AEPA+
- Manufacturer:
- Maxim Integrated
- Paglalarawan:
- IC VREF SERIES 2.5V 8DIP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16410 Pieces
- Data sheet:
- 1.MAX6225AEPA+.pdf2.MAX6225AEPA+.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MAX6225AEPA+, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MAX6225AEPA+ sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Output (Min / Fixed): | 2.5V |
|---|---|
| Boltahe - Output (Max): | - |
| Boltahe - Input: | 8 V ~ 36 V |
| pagpapaubaya: | ±0.04% |
| temperatura koepisyent: | 3ppm/°C |
| Supplier aparato Package: | 8-PDIP |
| serye: | - |
| Type reference: | Series, Buried Zener |
| packaging: | Tube |
| Package / Kaso: | 8-DIP (0.300", 7.62mm) |
| Type output: | Fixed |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Ingay - 10Hz sa 10kHz: | 1.3µVrms |
| Ingay - 0.1Hz sa 10Hz: | 1.5µVp-p |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | MAX6225AEPA+ |
| Ang pinalawak Paglalarawan: | Series, Buried Zener Voltage Reference IC ±0.04% 15mA 8-PDIP |
| paglalarawan: | IC VREF SERIES 2.5V 8DIP |
| Current - Supply: | 3mA |
| Current - Output: | 15mA |
| Current - katod: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MAX6225AEPA+
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers