Bumili MBR60060CT sa BYCHPS
Bumili na may garantiya
MBR60060CT
- Numero ng Bahagi:
- MBR60060CT
- Manufacturer:
- GeneSiC Semiconductor
- Paglalarawan:
- DIODE MODULE 60V 300A 2TOWER
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12651 Pieces
- Data sheet:
- 1.MBR60060CT.pdf2.MBR60060CT.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MBR60060CT, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MBR60060CT sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Forward (Vf) (Max) @ Kung: | 800mV @ 300A |
|---|---|
| Boltahe - DC Reverse (Vr) (Max): | 60V |
| Supplier aparato Package: | Twin Tower |
| bilis: | Fast Recovery = 200mA (Io) |
| serye: | - |
| packaging: | Bulk |
| Package / Kaso: | Twin Tower |
| Ibang pangalan: | MBR60060CTGN |
| Operating Temperature - Junction: | -50°C ~ 150°C |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 4 Weeks |
| Manufacturer Bilang Bahagi: | MBR60060CT |
| Ang pinalawak Paglalarawan: | Diode Array 1 Pair Common Cathode Schottky 60V 300A Chassis Mount Twin Tower |
| Type diode: | Schottky |
| diode Configuration: | 1 Pair Common Cathode |
| paglalarawan: | DIODE MODULE 60V 300A 2TOWER |
| Current - Reverse pagtagas @ Vr: | 1mA @ 20V |
| Kasalukuyang - Average rectified (Io) (per Diode): | 300A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MBR60060CT
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers