Bumili MCIMX6D6AVT08AC sa BYCHPS
Bumili na may garantiya
MCIMX6D6AVT08AC
- Numero ng Bahagi:
- MCIMX6D6AVT08AC
- Manufacturer:
- NXP Semiconductors / Freescale
- Paglalarawan:
- IC MPU I.MX6D 852MHZ 624FCBGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13176 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MCIMX6D6AVT08AC, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MCIMX6D6AVT08AC sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - I / O: | 1.8V, 2.5V, 2.8V, 3.3V |
|---|---|
| USB: | USB 2.0 + PHY (4) |
| Supplier aparato Package: | 624-FCBGA (21x21) |
| bilis: | 852MHZ |
| serye: | i.MX6D |
| Katangian ng seguridad: | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| SATA: | SATA 3Gbps (1) |
| RAM Controllers: | LPDDR2, LVDDR3, DDR3 |
| packaging: | Tray |
| Package / Kaso: | 624-FBGA, FCBGA |
| Ibang pangalan: | 935317648557 |
| operating Temperature: | -40°C ~ 125°C (TJ) |
| Bilang ng Cores / Bus Lapad: | 2 Core, 32-Bit |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | MCIMX6D6AVT08AC |
| graphics Acceleration: | Yes |
| Ang pinalawak Paglalarawan: | ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHZ 624-FCBGA (21x21) |
| Ethernet: | 10/100/1000 Mbps (1) |
| Display & Interface Controllers: | Keypad, LCD |
| paglalarawan: | IC MPU I.MX6D 852MHZ 624FCBGA |
| core Processor: | ARM® Cortex®-A9 |
| Co-Processor / DSP: | Multimedia; NEON™ SIMD |
| karagdagang Interface: | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MCIMX6D6AVT08AC
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers