Bumili MSDM150-16 sa BYCHPS
Bumili na may garantiya
MSDM150-16
- Numero ng Bahagi:
- MSDM150-16
- Manufacturer:
- Microsemi
- Paglalarawan:
- MOD BRIDGE 3PH 1600V 150A M3-1
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18716 Pieces
- Data sheet:
- MSDM150-16.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MSDM150-16, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MSDM150-16 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Peak Reverse (Max): | 1600V |
|---|---|
| Boltahe - Forward (Vf) (Max) @ Kung: | 1.4V @ 150A |
| teknolohiya: | Standard |
| Supplier aparato Package: | M3-1 |
| serye: | - |
| packaging: | Bulk |
| Package / Kaso: | M3-1 |
| operating Temperature: | -40°C ~ 150°C (TJ) |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | MSDM150-16 |
| Ang pinalawak Paglalarawan: | Bridge Rectifier Three Phase 1600V 150A Chassis Mount M3-1 |
| Type diode: | Three Phase |
| paglalarawan: | MOD BRIDGE 3PH 1600V 150A M3-1 |
| Current - Reverse pagtagas @ Vr: | 500µA @ 1600V |
| Kasalukuyang - Average rectified (Io): | 150A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MSDM150-16
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers