Bumili NOJA685M006RWJ sa BYCHPS
Bumili na may garantiya
NOJA685M006RWJ
- Numero ng Bahagi:
- NOJA685M006RWJ
- Manufacturer:
- AVX Corporation
- Paglalarawan:
- CAP NIOB OXI 6.8UF 20% 6.3V 1206
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17867 Pieces
- Data sheet:
- NOJA685M006RWJ.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa NOJA685M006RWJ, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa NOJA685M006RWJ sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 6.3V |
|---|---|
| pagpapaubaya: | ±20% |
| Supplier aparato Package: | 1206 (3216 Metric) |
| Sukat / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| serye: | OxiCap® NOJ |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1206 (3216 Metric) |
| operating Temperature: | -55°C ~ 105°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Size Code: | A |
| Manufacturer Bilang Bahagi: | NOJA685M006RWJ |
| Taas - Makaupo (Max): | 0.071" (1.80mm) |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | 6.8µF Niobium Oxide Capacitor 6.3V 1206 (3216 Metric) 2.6 Ohm ESR |
| ESR (Katumbas Series pagtutol): | 2.6 Ohm |
| pagwawaldas Factor: | 6% |
| paglalarawan: | CAP NIOB OXI 6.8UF 20% 6.3V 1206 |
| Current - Leakage: | 1.1µA |
| kapasidad: | 6.8µF |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa NOJA685M006RWJ
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
NOJD337M006RWJ | AVX Corporation | CAP NIOB OXI 330UF 20% 6.3V 2917 | Pagtatanong |
 |
NOJA685M010RWJ | AVX Corporation | CAP NIOB OXID 6.8UF 20% 10V 1206 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers