Bumili NOSX686M006R0100 sa BYCHPS
Bumili na may garantiya
NOSX686M006R0100
- Numero ng Bahagi:
- NOSX686M006R0100
- Manufacturer:
- AVX Corporation
- Paglalarawan:
- CAP NIOB OXID 68UF 20% 6.3V 2917
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14131 Pieces
- Data sheet:
- NOSX686M006R0100.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa NOSX686M006R0100, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa NOSX686M006R0100 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 6.3V |
|---|---|
| pagpapaubaya: | ±20% |
| Supplier aparato Package: | 2917 (7343 Metric) |
| Sukat / Dimension: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| serye: | OxiCap® NOS |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 2917 (7343 Metric) |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Size Code: | X |
| Manufacturer Bilang Bahagi: | NOSX686M006R0100 |
| Taas - Makaupo (Max): | 0.059" (1.50mm) |
| Mga tampok: | Low ESR |
| Ang pinalawak Paglalarawan: | 68µF Niobium Oxide Capacitor 6.3V 2917 (7343 Metric) 100 mOhm ESR |
| ESR (Katumbas Series pagtutol): | 100 mOhm |
| pagwawaldas Factor: | 6% |
| paglalarawan: | CAP NIOB OXID 68UF 20% 6.3V 2917 |
| Current - Leakage: | 8.2µA |
| kapasidad: | 68µF |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa NOSX686M006R0100
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
NOJA476M002RWJ | AVX Corporation | CAP NIOB OXID 47UF 20% 2.5V 1206 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers