Bumili PS22056 sa BYCHPS
Bumili na may garantiya
PS22056
- Numero ng Bahagi:
- PS22056
- Manufacturer:
- Powerex, Inc.
- Paglalarawan:
- MOD IPM 1200V 25A DIP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17522 Pieces
- Data sheet:
- PS22056.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa PS22056, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa PS22056 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Isolation: | 2500VDC |
|---|---|
| Boltahe: | 1200V |
| uri: | IGBT |
| serye: | Intellimod™ |
| Package / Kaso: | 28-PowerDIP Module (1.882", 47.80mm) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 20 Weeks |
| Manufacturer Bilang Bahagi: | PS22056 |
| Ang pinalawak Paglalarawan: | Power Driver Module IGBT 3 Phase 1200V 25A 28-PowerDIP Module (1.882", 47.80mm) |
| paglalarawan: | MOD IPM 1200V 25A DIP |
| kasalukuyan: | 25A |
| configuration: | 3 Phase |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa PS22056
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
PS22052 | Powerex Inc. | MOD IPM 1200V 5A DIP | Pagtatanong |
|
PS22053 | Powerex Inc. | MOD IPM 1200V 10A DIP | Pagtatanong |
|
PS22054 | Powerex Inc. | MOD IPM 1200V 15A DIP | Pagtatanong |
 |
IRAM136-3063B | Infineon Technologies | IC HYBRID PWR 30A 600V RES SIP3 | Pagtatanong |
|
PM100CSA120 | Powerex Inc. | MOD IPM 6PAC 1200V 100A | Pagtatanong |
 |
FNB50560TD1 | Fairchild/ON Semiconductor | MODULE SPM 600V 5A SPM55 | Pagtatanong |
|
FSB50550BS | Fairchild/ON Semiconductor | POWER DRVR MOD 500V 3A 23SMD | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers