Bumili RJH60A83RDPE-00#J3 sa BYCHPS
Bumili na may garantiya
RJH60A83RDPE-00#J3
- Numero ng Bahagi:
- RJH60A83RDPE-00#J3
- Manufacturer:
- Renesas Electronics America
- Paglalarawan:
- IGBT 600V 20A 52W LDPAK
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18136 Pieces
- Data sheet:
- RJH60A83RDPE-00#J3.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa RJH60A83RDPE-00#J3, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa RJH60A83RDPE-00#J3 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 2.6V @ 15V, 10A |
| Test Kundisyon: | 300V, 10A, 5 Ohm, 15V |
| Td (on / off) @ 25 ° C: | 31ns/54ns |
| Ang paglipat Energy: | 230µJ (on), 160µJ (off) |
| Supplier aparato Package: | 4-LDPAK |
| serye: | - |
| Reverse Recovery Time (trr): | 130ns |
| Power - Max: | 52W |
| packaging: | Original-Reel® |
| Package / Kaso: | SC-83 |
| Ibang pangalan: | RJH60A83RDPE-00#J3DKR |
| operating Temperature: | 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | RJH60A83RDPE-00#J3 |
| Type input: | Standard |
| Type IGBT: | Trench |
| gate charge: | 19.7nC |
| Ang pinalawak Paglalarawan: | IGBT Trench 600V 20A 52W Surface Mount 4-LDPAK |
| paglalarawan: | IGBT 600V 20A 52W LDPAK |
| Current - Kolektor Pulsed (Icm): | - |
| Current - kolektor (Ic) (Max): | 20A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa RJH60A83RDPE-00#J3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers