Bumili SSM3K35MFV(TPL3) sa BYCHPS
Bumili na may garantiya
SSM3K35MFV(TPL3)
- Numero ng Bahagi:
- SSM3K35MFV(TPL3)
- Manufacturer:
- Toshiba Semiconductor
- Paglalarawan:
- MOSFET N-CH 20V 0.18A VESM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12627 Pieces
- Data sheet:
- 1.SSM3K35MFV(TPL3).pdf2.SSM3K35MFV(TPL3).pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa SSM3K35MFV(TPL3), mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa SSM3K35MFV(TPL3) sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 1V @ 1mA |
|---|---|
| Vgs (Max): | ±10V |
| teknolohiya: | MOSFET (Metal Oxide) |
| Supplier aparato Package: | VESM |
| serye: | π-MOSVI |
| Rds On (Max) @ Id, Vgs: | 3 Ohm @ 50mA, 4V |
| Power pagwawaldas (Max): | 150mW (Ta) |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | SOT-723 |
| Ibang pangalan: | SSM3K35MFV (TPL3) SSM3K35MFV(TPL3)TR SSM3K35MFVTPL3 |
| operating Temperature: | 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | SSM3K35MFV(TPL3) |
| Input Kapasidad (Ciss) (Max) @ Vds: | 9.5pF @ 3V |
| Gate Charge (Qg) (Max) @ Vgs: | - |
| Type FET: | N-Channel |
| FET Tampok: | - |
| Ang pinalawak Paglalarawan: | N-Channel 20V 180mA (Ta) 150mW (Ta) Surface Mount VESM |
| Drive Boltahe (Max Rds On, Min Rds On): | 1.2V, 4V |
| Alisan ng tubig sa Source Boltahe (Vdss): | 20V |
| paglalarawan: | MOSFET N-CH 20V 0.18A VESM |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 180mA (Ta) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa SSM3K35MFV(TPL3)
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers