Bumili STGIPN3H60-H sa BYCHPS
Bumili na may garantiya
STGIPN3H60-H
- Numero ng Bahagi:
- STGIPN3H60-H
- Manufacturer:
- ST
- Paglalarawan:
- MOD IGBT SLLIMM NANO 26-NDIP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18409 Pieces
- Data sheet:
- STGIPN3H60-H.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa STGIPN3H60-H, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa STGIPN3H60-H sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Isolation: | 1000Vrms |
|---|---|
| Boltahe: | 600V |
| uri: | IGBT |
| serye: | SLLIMM™ |
| Package / Kaso: | 26-PowerDIP Module (0.846", 21.48mm) |
| Ibang pangalan: | 497-13869-5 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | STGIPN3H60-H |
| Ang pinalawak Paglalarawan: | Power Driver Module IGBT 3 Phase 600V 3A 26-PowerDIP Module (0.846", 21.48mm) |
| paglalarawan: | MOD IGBT SLLIMM NANO 26-NDIP |
| kasalukuyan: | 3A |
| configuration: | 3 Phase |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa STGIPN3H60-H
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
STGIPN3H60AT | STMicroelectronics | IGBT BIPO 600V 3A DIP | Pagtatanong |
 |
STGIPN3H60A | STMicroelectronics | IGBT IPM MODULE 3A 600V NDIP-26L | Pagtatanong |
 |
STGIPN3H60T-H | STMicroelectronics | MOD IGBT SLLIMM NANO 26-NDIP | Pagtatanong |
 |
STGIPN3H60 | STMicroelectronics | IGBT IPM MODULE 3A 600V NDIP-26L | Pagtatanong |
 |
PS11013 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 8A | Pagtatanong |
 |
FNB41060 | Fairchild/ON Semiconductor | MOD SPM 600V 10A SPM26-AA | Pagtatanong |
|
PM150RSA060 | Powerex Inc. | MOD IPM 7PAC 600V 150A | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers