Bumili TC74LVX125FTELM sa BYCHPS
Bumili na may garantiya
TC74LVX125FTELM
- Numero ng Bahagi:
- TC74LVX125FTELM
- Manufacturer:
- Toshiba Semiconductor
- Paglalarawan:
- IC BUS BUFFER QUAD N-INV 14TSSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14743 Pieces
- Data sheet:
- TC74LVX125FTELM.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa TC74LVX125FTELM, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa TC74LVX125FTELM sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 2 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 14-TSSOP |
| serye: | TC74LVX |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 14-TSSOP (0.173", 4.40mm Width) |
| Type output: | Push-Pull |
| Ibang pangalan: | TC74LVX125FT (EL,M) TC74LVX125FT(EL,M) TC74LVX125FTELMTR TC74LVX125FTFTR TC74LVX125FTFTR-ND |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng mga Sangkap: | 4 |
| Bilang ng mga Bits per Element: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | TC74LVX125FTELM |
| logic Type: | Buffer, Non-Inverting |
| Type input: | - |
| Ang pinalawak Paglalarawan: | Buffer, Non-Inverting Element 1 Bit per Element Push-Pull Output 14-TSSOP |
| paglalarawan: | IC BUS BUFFER QUAD N-INV 14TSSOP |
| Current - Output Mataas, Mababa: | 4mA, 4mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa TC74LVX125FTELM
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers