Bumili TE0782-02-035-2I sa BYCHPS
Bumili na may garantiya
TE0782-02-035-2I
- Numero ng Bahagi:
- TE0782-02-035-2I
- Manufacturer:
- Trenz Electronic
- Paglalarawan:
- SOM ZYNQ XC7Z035-2I 1GB DDR3
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18978 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa TE0782-02-035-2I, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa TE0782-02-035-2I sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Sukat / Dimension: | 3.35" x 3.35" (85mm x 85mm) |
|---|---|
| serye: | TE078x |
| RAM Size: | 1GB |
| Ibang pangalan: | 1686-1052 TE0782-02-035-2I-ND |
| operating Temperature: | -40°C ~ 85°C |
| Module / Uri Board: | MCU, FPGA |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | TE0782-02-035-2I |
| Flash Size: | 32MB |
| Ang pinalawak Paglalarawan: | TE078x Embedded Module ARM Cortex-A9 Zynq-7000 (Z-7035) 1GB 32MB |
| paglalarawan: | SOM ZYNQ XC7Z035-2I 1GB DDR3 |
| core Processor: | ARM Cortex-A9 |
| Type connector: | Samtec QTH |
| Co-Processor: | Zynq-7000 (Z-7035) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa TE0782-02-035-2I
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
TE0782-02-100-2I | Trenz Electronic GmbH | SOM ZYNQ XC7Z100-2I 1GB DDR3 | Pagtatanong |
 |
TE0841-01-035-1C | Trenz Electronic GmbH | SOM USCALE XCKU035-1C 1GB DDR4 | Pagtatanong |
 |
FS-3000 | Digi International | MODULE 128MB SDRAM 128MB FLASH | Pagtatanong |
 |
TE0782-02-045-2I | Trenz Electronic GmbH | SOM SOC Z7045 2XUSB 2XGB ETH 1GB | Pagtatanong |
 |
100-1215-1 | Bluetechnix GmbH | MODULE ECM-BF561-C-I-Q25S128F32 | Pagtatanong |
 |
DC-ME-Y402-C-B | Digi International | ME 9210 8MB SDRAM 4MB FLASH 50PK | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers