Bumili TSXPC860SRVZQU66D sa BYCHPS
Bumili na may garantiya
TSXPC860SRVZQU66D
- Numero ng Bahagi:
- TSXPC860SRVZQU66D
- Manufacturer:
- Micrel / Microchip Technology
- Paglalarawan:
- IC MPU POWERPC 66MHZ 357BGA
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 16238 Pieces
- Data sheet:
- TSXPC860SRVZQU66D.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa TSXPC860SRVZQU66D, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa TSXPC860SRVZQU66D sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - I / O: | 3.3V |
|---|---|
| USB: | - |
| Supplier aparato Package: | 357-PBGA (25x25) |
| bilis: | 66MHz |
| serye: | - |
| Katangian ng seguridad: | - |
| SATA: | - |
| RAM Controllers: | DRAM |
| packaging: | Tray |
| Package / Kaso: | 357-BBGA |
| operating Temperature: | -40°C ~ 110°C (TC) |
| Bilang ng Cores / Bus Lapad: | 1 Core, 32-Bit |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | TSXPC860SRVZQU66D |
| graphics Acceleration: | No |
| Ang pinalawak Paglalarawan: | PowerPC Microprocessor IC - 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
| Ethernet: | 10/100 Mbps (1) |
| Display & Interface Controllers: | - |
| paglalarawan: | IC MPU POWERPC 66MHZ 357BGA |
| core Processor: | PowerPC |
| Co-Processor / DSP: | Communications; CPM |
| karagdagang Interface: | I²C, PCMCIA, SCC, SMC, SPI, UART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa TSXPC860SRVZQU66D
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers