Bumili VS-HFA04SD60S-M3 sa BYCHPS
Bumili na may garantiya
VS-HFA04SD60S-M3
- Numero ng Bahagi:
- VS-HFA04SD60S-M3
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Paglalarawan:
- DIODE GEN PURP 600V 4A TO252AA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15786 Pieces
- Data sheet:
- VS-HFA04SD60S-M3.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa VS-HFA04SD60S-M3, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa VS-HFA04SD60S-M3 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Forward (Vf) (Max) @ Kung: | 1.8V @ 4A |
|---|---|
| Boltahe - DC Reverse (Vr) (Max): | 600V |
| Supplier aparato Package: | D-PAK (TO-252AA) |
| bilis: | - |
| serye: | HEXFRED® |
| packaging: | Tube |
| Package / Kaso: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Ibang pangalan: | VS-HFA04SD60S-M3GI |
| Operating Temperature - Junction: | -55°C ~ 150°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 13 Weeks |
| Manufacturer Bilang Bahagi: | VS-HFA04SD60S-M3 |
| Ang pinalawak Paglalarawan: | Diode Standard 600V 4A Surface Mount D-PAK (TO-252AA) |
| Type diode: | Standard |
| paglalarawan: | DIODE GEN PURP 600V 4A TO252AA |
| Current - Reverse pagtagas @ Vr: | 3µA @ 600V |
| Kasalukuyang - Average rectified (Io): | 4A |
| Kapasidad @ Vr, F: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa VS-HFA04SD60S-M3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers