Bumili W83L604G sa BYCHPS
Bumili na may garantiya
W83L604G
- Numero ng Bahagi:
- W83L604G
- Manufacturer:
- Nuvoton Technology Corporation America
- Paglalarawan:
- IC I/O EXPANDER SMBUS 14B 20SSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16544 Pieces
- Data sheet:
- W83L604G.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa W83L604G, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa W83L604G sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 3.3V |
|---|---|
| Supplier aparato Package: | 20-SSOP |
| serye: | - |
| packaging: | Tube |
| Package / Kaso: | 20-SSOP (0.209", 5.30mm Width) |
| Type output: | Open Drain, Push-Pull |
| operating Temperature: | 0°C ~ 70°C |
| Bilang ng I / O: | 14 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | W83L604G |
| matakpan Output: | Yes |
| interface: | SMBus |
| Mga tampok: | Buzzer Outputs, LED Outputs, POR |
| Ang pinalawak Paglalarawan: | I/O Expander 14 SMBus 20-SSOP |
| paglalarawan: | IC I/O EXPANDER SMBUS 14B 20SSOP |
| Current - Output Source / Sink: | 16mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa W83L604G
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
W83L603G | Nuvoton Technology Corporation of America | IC I/O EXPANDER SMBUS 8B 14SOIC | Pagtatanong |
 |
PCA9536DG4 | Texas Instruments | IC I/O EXPANDER I2C 4B 8SOIC | Pagtatanong |
 |
PCA9535HF,118 | NXP USA Inc. | IC I/O EXPANDER I2C 16B 24HWQFN | Pagtatanong |
 |
MAX7312AAG+T | Maxim Integrated | IC I/O EXPANDER I2C 16B 24SSOP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers